BGA–Push Pin Attachment
Mechanical drawings
FIGURE 1
FIGURE 2
"H"
FIGURE 3
41.70
(1.642)
"T"
"S"
"T"
"H"
"L"
"L"
"L"
41.50
(1.634)
"W"
"W"
"T"
"W"
"H"
FIGURE 4
FIGURE 5
"S"
"T"
"H"
"S"
20.02
"L"
(0.788)
"L"
"T"
10.69
(0.421)
"W"
"W"
"H"
Board mounting pattern information
FIGURE A
FIGURE B
ø 3.10
±
0.030
(0.122
±
0.001)
THROUGH HOLES
(UNPLATED) 2X
46.60
(1.830) REF
32.95
(1.297)
Ø 3.10 0.03
(0.122 0.001)
THROUGH HOLES
16.48 (UNPLATED) 2X
(0.649)
32.95
(1.297)
20.87
(0.822)
41.74
(1.643)
59.00
(2.320)REF
41.74
(1.643)
20.87
(0.822)
16.48
(0.649)
FIGURE C
FIGURE D
20.02
(0.788)
Ø 3.10
±
0.03
( Ø 0.122
±
0.001)
THROUGH HOLES
(UNPLATED) 2X
Ø 3.10
±
0.03
(Ø 0.122
±
0.001)
THROUGH HOLES
(UNPLA TED) 2X
41.50
(1.634)
20.85
(0.821)
41.70
(1.642)
10.01
(0.394)
50.80
(2.000)
25.40
(1.000)
20.75
(0.817)
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15
HEAT SINKS FOR IC PACKAGES
46.60
(1.835)
AAVID [ AAVID THERMALLOY, LLC ]
