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504222B00000G 参数 Datasheet PDF下载

504222B00000G图片预览
型号: 504222B00000G
PDF下载: 下载PDF文件 查看货源
内容描述: 如何使用本产品目录 [How to Use This Catalog]
分类和应用: 散热片耐热支撑装置
文件页数/大小: 116 页 / 8734 K
品牌: AAVID [ AAVID THERMALLOY, LLC ]
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BGA–Push Pin Attachment
Push pin attachment
Push pin heat sinks require two 3.10mm holes in the circuit card
to quickly attach the heat sink over the device. The one piece
design makes assembly a snap. Pressure is maintained by the
tension of the push pin coil springs to ensure even pressure
across the device. Push pins provide a greater margin of reliabil-
ity in applications where gravity or vibration may cause tapes or
adhesives to fail. The addition of a phase change pad optimizes
thermal performance.
HEAT SINKS FOR IC PACKAGES
ORDERING INFORMATION
IC Pkg. Size (mm)
28 x 28
28 x 28
28 x 28
35 x 35
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
37.5 x 37.5
45 x 45
45 x 45
45 x 45
Part Number
10-6326-27G
10-6326-28G
10-6327-01G
10-TNT2-01G
10-5597-02G
10-5597-22G
10-5597-33G
10-5607-04G
10-5607-05G
372924M02000G
10-L4LB-03G
10-L4LB-05G
10-L4LB-11G
“W”
(mm)
28.00
28.00
28.50
36.10
37.40
37.40
37.40
37.40
37.40
37.40
45.20
45.20
45.20
“L”
(mm)
28.00
28.00
28.50
48.00
37.40
37.40
37.40
37.40
37.40
37.40
41.40
41.40
41.40
“H”
(mm)
6.00
6.00
10.00
11.60
6.00
6.00
6.00
10.00
10.00
6.00
11.89
11.89
11.70
59.00
59.00
59.00
59.00
59.00
59.00
58.80
58.80
58.80
“S”
(mm)
46.60
46.60
46.60
“T” (mm)
6.50
6.50
7.00
6.50
6.50
6.50
6.50
7.00
7.00
6.50
8.00
8.00
8.00
θn
2
44.10
44.10
30.60
18.80
33.30
33.30
33.30
22.10
22.10
32.60
16.70
16.70
14.20
θf
3
13.13
13.13
9.26
6.13
9.91
9.91
9.91
6.99
6.99
9.91
5.60
5.60
4.91
Finish
Black anodize
Black anodize
Black anodize
Black anodize
Green anodize
Gold anodize
Gold anodize
Black anodize
Black anodize
Green anodize
Black anodize
Black anodize
Black anodize
Fig.
1
1
2
3
5
5
5
5
5
5
4
4
4
PCB Fig.
1
A
A
A
D
B
B
B
B
B
B
C
C
C
Pin Style
Plastic
Brass
Plastic
Plastic
Plastic
Plastic
Brass
Plastic
Brass
Plastic
Plastic
Brass
Plastic
Pad
Yes
Yes
No
No
No
Yes
Yes
Yes
Yes
No
Yes
Yes
No
1. Push pin mechanical drawings and board mounting drawings see page 15
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
14
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