SPECIFICATION FOR APPROVAL
REF : 20080424-A
PROD.
NAME
ABC'S DWG No.
AL1005□□□□L□-□□□
PAGE: 5
THIN FILM CHIP INDUCTOR
ABC'S ITEM No.
Ⅷ﹒RELIABILITY
TEST：
Test item
Specification
More than 95% of the
terminal electrode
Shall be covered
With fresh solder.
Test condition
Preheat : 155
℃
/ 4 hours.
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent
Solder temp. : 235±5℃
Flux : Rosin
Dip time : 5±0.5 seconds
Solderability
Thermal shock test
( Temp. cycle )
Electrical oharacteristics shall
not change more
than
±20%
Room temp.
15 minutes
Room temp.
15 minutes
Total : 50 cycles
-55
℃
30 minutes
+125
℃
30 minutes
Humidity Test
Temperature : 40±2℃
Humidity : 90±5%
Time : 1000 hours
High temp.
Resistance test
Temperature : 125±5℃
Applied current : Per spec.
Time : 96 hours
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
