SPECIFICATION FOR APPROVAL
REF : 20070123-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
CB3011□□□□L□-□□□
SMD POWER INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A :
B :
C :
D :
E :
F :
G:
H:
3.60±0.15
3.90 max.
1.10±0.10
1.10±0.30
0.80±0.20
1.60 ref.
4.00 ref.
1.00 ref.
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
4R7
E
G
D
C
B
F
H
(PCB Pattern Suggestion)
Ⅱ﹒SCHEMATIC
DIAGRAM：
a
c
b
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite core
b﹒Wire：Enamelled copper wire
c﹒Base：Cu/Ag(1.0um)
d﹒Adhesive：Epoxy resin
e﹒Remark：Products comply with RoHS'
requirements
Temperature (
℃
)
250
d
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260℃
50sec max.
230℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：40℃
typ.
b﹒Storage temp.：-40℃ ----+120℃
c﹒Operating temp.：-40℃----+125℃
(included Temp. rise)
d﹒Resistance to solder heat：260℃.10 secs.
AR-001A
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
