SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
CC2520□□□□3□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A
B
C
B
E
F
Not Marking
: 2.5±0.2
: 2.0±0.1
: 1.8±0.1
: 1.4±0.1
: 0.40
m/m
m/m
m/m
m/m
m/m
0.50
C
0.9
1.5
0.9
F
F
E
（
PCB Pattern
）
Ⅱ﹒SCHEMATIC
DIAGRAM：
d
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Wire
：Enamelled
copper wire
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
Peak Temp：245℃ max.
Max time above 225℃
：30sec
max.
Max time above 200℃
：50sec
max.
Temperature
Rising Area
2 ~ 4
℃
/ sec
Preheat Area
150 ~ 180
℃
/ 90 ~ 150sec
Reflow Area
2 ~ 4
℃
/ sec
240±5
℃
1.5
a
c
b
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：20℃
max.
b﹒Ambient temp.：80℃ max.
c﹒Storage temp.：-40℃ ----+100℃
d﹒Operating temp.：-40℃----+85℃
e﹒Terminal strength：0.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-001A
Temperature (
℃
)
Forced Cooling Area
3 ~ 5
℃
/ sec
250
200
150
100
50
10sec
30sec max.
( 20~30sec )
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
