SPECIFICATION FOR APPROVAL
REF : 20071102-D
PROD.
NAME
ABC'S DWG NO.
CC4532□□□□L□-□□□
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
B
C
4.2±0.2
E
F
:
:
:
:
4.5±0.3
3.2±0.2
3.2��0.2
1.2
m/m
m/m
m/m
m/m
m/m
330K
Marking
Inductance code
: 1.0 +0.3
-0
C
F
A
F
E
B
1.5
2.2
1.5
（
PCB Pattern
）
Ⅱ﹒SCHEMATIC
DIAGRAM：
d
a
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Wire
：Enamelled
copper wire (class H)
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
1.6
c
b
Reflow profile
Peak Temp：250℃ max.
Max time above 245℃
：20~40sec
max.
Max time above 217℃
：60~150sec
max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperatu re
Rising Area
Preheat Area
150 ~ 200
℃
/ 60 ~ 180sec
Reflow Area
Forced Cooling Area
6
℃
/ second max.
P eak Temperature
：
250
℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：20℃
max.
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
e﹒Terminal pull strength：1.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-001A
Temperature (
℃
)
250
245
217
200
150
100
50
2 0~40sec
60~150sec
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
