SPECIFICATION FOR APPROVAL
REF : 20070124-C
20080502-H
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
CM3225□□□□L□-□□□
WOUND CHIP INDUCTOR
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
:
:
:
:
3.2±0.4
2.5±0.2
2.2±0.2
m/m
m/m
m/m
100
Marking
Inductance code
B
C
E
2.9±0.2
m/m
1.0±0.2
m/m
F : 0.6 +0.3
-0
+0
※ △
K=
∣
K1-K2
∣
=0.25 m/m
C
F
A
F
K1 E K2
B
1
1.8
1
（
PCB Pattern
）
Ⅱ﹒SCHEMATIC
DIAGRAM：
1.4
d
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Wire
：Enamelled
copper wire (class H)
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
a
c
b
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：20℃
max.
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
e﹒Terminal pull strength：1.5 kg min.
Temperature (
℃
)
Reflow profile
Peak Temp：250℃ max.
Max time above 245℃
：20~40sec
max.
Max time above 217℃
：60~150sec
max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperature
Rising Area
Preheat Area
150 ~ 200
℃
/ 60 ~ 180sec
Reflow Area
Forced Cooling Area
6
℃
/ second max.
Peak Temperature
：
250
℃
250
245
217
200
150
100
50
20~40sec
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
60~150sec
0
50
100
150
Time ( seconds )
200
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
