SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
MULTILAYER CHIP BEAD
ABC'S ITEM NO.
M□□□□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
C
I
B
G
I
( PCB Pattern )
Unit : m/m
C
D
0.30±0.2
0.50±0.3
0.60±0.4
G
0.7
1.0
2.2
H
0.7
1.0
1.4
I
0.7
1.0
1.1
Series
M□1608
M□2029
M□3261
A
1.6±0.2
2.0±0.2
3.2±0.2
B
0.8±0.2
1.2±0.2
1.6±0.2
0.8±0.2
0.9±0.2
1.1±0.2
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
a
b
H
c
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
D
D
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
c﹒Terminal strength：
F
Type
M□1608
M□2029
M□3261
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
0.5
0.6
1.0
Time ( sec )
250
Temperature (
℃
)
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
P eak Temperature:
260
℃
230
℃
30±5
50s ec max.
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
