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MH10054N7DL 参数 Datasheet PDF下载

MH10054N7DL图片预览
型号: MH10054N7DL
PDF下载: 下载PDF文件 查看货源
内容描述: 多层片式电感器 [MULTILAYER CHIP INDUCTOR]
分类和应用: 电感器
文件页数/大小: 6 页 / 102 K
品牌: ABC [ ABC Taiwan Electronics Corp ]
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SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MH1005□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS:
A
A
B
B
C
D
D
:
:
:
:
1.00±0.10
0.50±0.10
0.50±0.10
0.23±0.10
m/m
m/m
m/m
m/m
Ⅱ﹒SCHEMATIC
DIAGRAM:
Ⅲ﹒FEATURES:
a﹒Monolithic structure ensuring high performance and reliability.
b﹒High frequency applications up to 6GHz.
c﹒Terminal:Ag/Cu/Ni/Sn
d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒APPLICATIONS:
a﹒RF modules for telecommunication systems including
GSM, PCS,DECT,WLAN,Bluetooth,etc.
Peak Temp:260℃ max.
Max time above 230℃
:50sec
max.
Max time above 200℃
:70sec
max.
C
Ⅴ﹒GENERAL
SPECIFICATION:
a﹒Storage temp.:-55℃---- +125℃
b﹒Operating temp.:-55℃ ---- +125℃
c﹒Solderability:Preheat 150℃. 60 sec
Solder:H63A
Solder temp.:230±5℃
Flux:Rosin
Dip time:4±1 sec
Temperature (
)
250
Temperature
Rising Area
+4.0
/ sec max.
Preheat Area
150 ~ 200
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
/ sec max.
Peak Temperature:
260
230
50sec max.
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
AR-001A