SPECIFICATION FOR APPROVAL
REF :
20090811-A
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
MS20□□□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒
CONFIGURATION & DIMENSIONS
:
A
D
D
H
C
I
B
G
( PCB Pattern )
Unit : m/m
C
0.90±0.20
1.20±0.20
D
0.50±0.30
0.50±0.30
G
1.0
1.0
H
1.0
1.0
I
1.0
1.0
I
Series
MS2029
MS2022
A
2.00±0.20
2.00±0.20
B
1.20±0.20
1.20±0.20
Ⅱ﹒
SCHEMATIC DIAGRAM
:
Ⅲ﹒
MATERIALS
:
a
﹒
Body
:
Ferrite
b
﹒
Internal conductor
:
Silver or Ag / Pd
c
﹒
Terminal
:
Cu/Sn
d
﹒
Remark
:
Products comply with RoHS' requirements
a
b
c
Ⅳ﹒
GENERAL SPECIFICATION
:
a
﹒
Storage temp.
:
-40 ---- +105
℃
b
﹒
Operating temp.
:
-55 ---- +125
℃
c
﹒
Terminal Strength
:
F
Type
MS2022
MS2029
F ( kgf )
0.8
0.6
time ( sec )
30±5
Temperature (
℃
)
250
50sec max.
Peak Temp
:
260
℃
max.
Max time above 230
℃ :
50sec max.
Max time above 200
℃ :
70sec max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
230
℃
200
150
70sec max.
d
﹒
Solderability
:
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
100
50
0
50
100
150
Time ( seconds )
200
250