SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MULTILAYER CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
D
D
C
I
B
G
I
( PCB Pattern )
Unit : m/m
C
D
0.60±0.40
G
2.2
H
1.4
I
1.1
Series
MS3261
A
3.20±0.20
B
1.60±0.20
1.10±0.20
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Cu/Sn
d﹒Remark：Products comply with RoHS' requirements
a
b
H
c
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40℃---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal storength：
F
Type
MS3261
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
1.0
time ( sec )
30±5
Temperature (
℃
)
250
50sec max.
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperatu re
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Coo ling Area
-(1 .0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
230
℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
