SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
ABC'S DWG NO.
PAGE: 1
MULTILAYER CHIP BEAD
ABC'S ITEM NO.
MU1005□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
D
D
C
B
I
G
PCB Pattern
I
Unit : m/m
Series
MU1005
A
1.00±0.10
B
0.50±0.10
C
0.50±0.10
D
0.20±0.10
G
0.4
H
0.4
H
I
0.5
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
a
b
c
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40 ---- +105℃
b﹒Operating temp.：-55 ---- +125℃
c﹒Terminal strength：
F
Type
MU1005
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
F ( kgf )
0.3
Time ( sec )
30±5
Temperature (
℃
)
250
50s ec max.
Peak Temp：260℃ max.
M ax tim e above 230℃
：50sec
max.
M ax tim e above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
P eak Temperature:
260
℃
230
℃
200
150
70sec max.
100
50
0
50
100
150
Tim e ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
