SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
SMD POWER INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SB5009□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
4
3
100
1
2
D
G
D
H
I
H
L
A
B
C
D
E
F
G
H
I
J
K
L
M
:
:
:
:
:
:
:
:
:
:
:
:
:
5.60
6.00
0.95
1.00
5.20
3.20
0.80
1.30
2.00
6.40
4.60
1.30
3.80
±0.3
±0.3
±0.1
typ.
typ.
typ.
ref.
ref.
ref.
ref.
ref.
ref.
ref.
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
C
B
E
F
K
( PCB Pattern Suggestion )
Ⅱ﹒SCHEMATIC
DIAGRAM：
1
3
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Base：PCB Base FR4
c﹒Adhesive
：Epoxy
resin
d﹒Wire：Enamelled copper wire
（class
F）
e﹒Terminal：Cu/Ni/Au
f﹒Remark：Products comply with RoHS'
requirements
250
Temperature (
℃
)
L
a
b
d
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area Forced Cooling Area
+2.0 ~ 4.0
℃
-(1.0 ~ 5.0)
℃
/ sec max.
/ sec max.
Peak Temperature:
260℃
50sec max.
230℃
M
J
100
c
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp. rise
：40℃
typ.
b﹒Storage Temp.：-40℃ ----+125℃
c﹒Operating Temp.：-40℃----+125℃
( Temp. rise Included )
d﹒Resistance to solder heat
：260℃.10
secs.
AE-001A
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
