SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
SL1608□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
B
C
D
C
:
:
:
:
0.9
A
1.6±0.2
0.8±0.2
0.8±0.2
0.4 typ.
0.9
0.9
m/m
m/m
m/m
m/m
D
D
B
2.7
( PCB Pattern )
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Core：Ceramic
b﹒Wire
：Copper
c﹒Terminal：Solder coat over Ni plate (Lead content 100ppm max.)
d﹒Coating：Epoxy resin
e﹒Remark：Products comply with RoHS'
requirements
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
a
c
d
b
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
50sec max.
230
℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp rise
：15℃
max
b﹒Rated current：Current cause inductance
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+105℃
e﹒Resistance to solder heat：260℃.10 secs.
Temperature (
℃
)
250
200
150
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
drop within 10% max.
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
0.9
250
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
