SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
MULTILAYER CHIP BEAD
ABC'S DWG NO.
ABC'S ITEM NO.
SM□□□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
D
D
I
C
B
Series
SM4532
SM4516
SM3266
SM3261
SM2029
SM1608
A
4.5±0.2
4.5±0.2
3.2±0.2
3.2±0.2
2.0±0.2
1.6±0.2
B
3.2±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
C
1.5±0.2
1.6±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
D
0.60±0.4
0.60±0.4
0.60±0.4
0.60±0.4
0.50±0.3
0.30±0.2
G
( PCB Pattrn )
I
G
3.0
3.0
2.2
2.2
1.0
0.7
H
3.0
1.4
1.4
1.4
1.0
0.7
H
Unit : m/m
I
1.5
1.5
1.1
1.1
1.0
0.7
a
b
c
F
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
50sec max.
230
℃
Ⅱ﹒SCHEMATIC
DIAGRAM：
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal electrode：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS' requirements
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal Strength：
Temperature (
℃
)
Type
SM4532
SM4516
SM3261
SM3266
SM2029
SM1608
d﹒Solderability：
F ( kgf )
1.5
1.0
1.0
1.0
0.6
0.5
time ( sec )
250
30±5
200
150
70sec max.
100
50
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
