SPECIFICATION FOR APPROVAL
REF : 20080711-B
PROD.
NAME
ABC'S DWG NO.
SW1005□□□□L□-□□□
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A
: 1.00
±
0.1
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
B : 0.55
±
0.1
C : 0.50
±
0.1
D
TOP View
D
E
F
C
G
H
SIDE View
E
F
E
I
: 0.30
:
:
0.20
0.50
B
: 0.40
: 0.40
:
0.50
BOTTOM View
I
G
I
( PCB Pattern )
Ⅱ﹒SCHEMATIC
DIAGRAM：
d
Ⅲ﹒MATERIALS：
a﹒Core：Ceramic
b﹒WIRE
：Enamelled
copper wire (class H)
c﹒Terminal：Mo / Mn + Ni + Au
d﹒Encapsulate：Epoxy
e﹒Remark：Products comply with RoHS'
requirements
250
H
a
c
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
Forced Cooling Area
b
+2.0 ~ 4.0
℃
-(1.0 ~ 5.0)
℃
/ sec max.
/ sec max.
Peak Temperature:
260℃
50sec max.
230℃
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp rise
：15℃
max
b﹒Rated current：Current cause inductance
drop within 10% max.
c﹒Stopage temp.：-55℃ ----+125℃
d﹒Operating temp.：-55℃----+125℃
AR-001A
Temperature (
℃
)
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
