SPECIFICATION FOR APPROVAL
REF : 20090828-C
PROD.
NAME
ABC'S DWG NO.
SW1608□□□□L□-□□□
PAGE: 1
WOUND CHIP INDUCTOR
ABC'S ITEM NO.
Ⅰ﹒CONFIGURATION
& DIMENSIONS：
A
A
B
B
C
D
E
F
G
C
H
I
E
F
E
H
I
G
I
( PCB Pattern )
D
:
1.60±0.2
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
: 1.05±0.2
: 1.05±0.2
: 0.50
: 0.35
: 0.90
:
:
:
0.70
1.20
0.45
Ⅱ﹒SCHEMATIC
DIAGRAM：
d
Ⅲ﹒MATERIALS：
a﹒Core：Ceramic
b﹒WIRE
：Enamelled
copper wire (class H)
c﹒Terminal：Mo / Mn + Ni + Au
d﹒Encapsulate：Epoxy
e﹒Remark：Products comply with RoHS'
requirements
c
Peak Temp：260℃ max.
Max time above 230℃
：50sec
max.
Max time above 200℃
：70sec
max.
Temperature
Rising Area
+4.0
℃
/ sec max.
Preheat Area
150 ~ 200
℃
/ 60 ~ 120sec
Reflow Area
+2.0 ~ 4.0
℃
/ sec max.
a
b
Forced Cooling Area
-(1.0 ~ 5.0)
℃
/ sec max.
Peak Temperature:
260
℃
250
Ⅳ﹒GENERAL
SPECIFICATION：
a﹒Temp rise
：15℃
max.
b﹒Rated current：Current cause inductance
drop within 10% max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
AR-001A
Temperature (
℃
)
50sec max.
230
℃
200
150
70sec max.
100
50
0
50
100
150
Time ( seconds )
200
250
ABC [ ABC Taiwan Electronics Corp ]
