Issue: Oct. 29
th
, 2012
of Issue: Oct. 29
th
, 2012
Page (6) of (15)
Solid Tantalum Chip Capacitor
ATCC-211(A, B,
x
P)
x
Series
3.5 2.80 1.9mm
ATCC-211(A, B, P) Series
3.2 x 1.60 x 1.6mm
Solid Tantalum Chip Capacitor
3.5 x 2.80 x 1.9mm
3.2 x 1.60 x 1.6mm
1.1mm
2.0 x 1.25 x
Abracon Drawing # 603389
ATCC-211(A, B, P) Series
Solid Tantalum Chip Capacitor
age (6) of (15)
2.0 x 1.25 1.1mm
Abracon
x
Drawing # 603389
Revision #: Initial Release
ESD Sensitive
Revision #: Initial Release
Pb
ESD Sensitive
RoHS
Compliant
3.2 x 1.60 x 1.6mm
3.5 x 2.80 x 1.9mm
2.0 x 1.25 x 1.1mm
Date
OUTLINE
Mechanical Dimensions
hanical Dimensions
DIMENSIONS:
6.0
M
Recommended Land Pattern
Recommended Land Pattern
P
Dimension
Code
A
B
L
2.0±0.15
3.2±0.20
3.5±0.2
W
1.25±0.15
1.6±0.20
2.8±0.2
H
1.1±0.15
1.6±0.20
1.9±0.2
F(±0.10)
0.9
1.2
2.2
S(±0.30)
0.5
0.8
0.8
A
1.1
1.1
1.4
B
1.05
1.35
1.35
C
1.2
1.5
2.7
ommended Land Pattern
Materials
Dimensions: mm
6.1
mension
Code
P
A
B
L
2.0±0.15
3.2±0.20
3.5±0.2
W
1.25±0.15
1.6±0.20
2.8±0.2
H
1.1±0.15
1.6±0.20
1.9±0.2
F(±0.10)
0.9
1.2
2.2
S(±0.30)
0.5
0.8
0.8
A
1.1
1.1
1.4
B
1.05
1.35
1.35
C
1.2
1.5
2.7
*The Case is black molded
nsion
mm
ions:
de
REFLOW PROFILE:
1.1±0.15
2.0±0.15
1.25±0.15
3.2±0.20
3.5±0.2
1.6±0.20
2.8±0.2
1.6±0.20
1.9±0.2
L
W
H
F(±0.10)
0.9
1.2
2.2
S(±0.30)
0.5
0.8
0.8
A
1.1
1.1
1.4
∆
∆
∆
∆
∆
∆
B
1.05
1.35
1.35
C
Di
: mm
1.2
1.5
2.7
Preheat condi
tion: 150 ~200˚C /60~120sec.
Allowed time above 217˚C: 60~90sec.
Max temp: 260˚C
Max time at max temp: 10sec.
Solder paste: Sn/3.0Ag/0.5Cu
Allowed Reflow time: 2x max
Dimens
ABRACON IS
ISO9001:2008
CE RTIFIED
Revised: 12.22.12
30332 E speranza, Rancho Santa Margarita, California 92688
tel 949-546-80 0
|
fax 949-546-80 1
| www.abracon.com
0
0
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ABRACON [ ABRACON CORPORATION ]
