Tel : +44 118 979 1238
Fax : +44 118 979 1283
Email: info@actcrystals.com
6.Reliability Test
6.1 Life Test
Item
High Temperature Exposure
Test Condition
Tstg Max.(85°C),500h
Topr Max.( 70°C),DC 0.5V
(In or Out),500h
Tstg Min.( -55°C),500h
Ta=60°C,RH=90%,500H
Limit
High Temperature Operation
Δfo≤±0.5%
(Δfo: Deviation of centre
frequency fo)
Low Temperature Exposure
Moisture Resistance
6.2 Environmental Test
Item
TCT
Test Condition
(-20°C 30min.
→
25°C 5min.
→
80°C
30min.
→25°C
5min.), 5cycles
Immerse the pins in melt solder at 230±5
°C
for 5 seconds.
Set on PC board, immerse in melt solder
at 260±5°C for 6±2 seconds.
Limit
Same as 6.1
More than 95% of total area
of the pins should be covered
with solder
Same as 6.1
Soldering
Heat Resistivity for
Melt Solder
6.3 Mechanical Test
Item
Drop
Lead Bend
Lead Pull
Test Condition
On maple plate from 1m high,3times.
π
/ 2 rad bending, with 4.4N weight,2 times.
After bending lead parallel to heater base, pull with 9.8N force
for 1 minute.
Limit
Same as 6.1
In keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice.
ISO9001: 2000 Registered - Registration number 6830/2
For quotations or further information please contact us at:
3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK
Issue : 1 C1
Date : SEPT 04
ACT [ ADVANCED CRYSTAL TECHNOLOGY ]
