SX-A Family FPGAs
Ordering Information
A54SX16A
2
PQ
208
G
Application (Temperature Range)
Blank = Commercial (0 to +70°)
I
= Industrial (-40 to +85°C)
A
= Automotive (-40 to +125°C)
M = Military (-55 to +125°C)
= MIL-STD-883 Class B
B
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
BG = 1.27 mm Plastic Ball Grid Array
FG = 1.0 mm Fine Pitch Ball Grid Array
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
CQ = Ceramic Quad Flat Pack1
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard2
–F = Approximately 40% Slower than Standard
Part Number
A54SX08A = 12,000 System Gates
A54SX16A = 24,000 System Gates
A54SX32A = 48,000 System Gates
A54SX72A = 108,000 System Gates
Notes:
1. For more information about the CQFP package options, refer to the HiRel SX-A datasheet.
2. All –3 speed grades have been discontinued.
Device Resources
User I/Os (Including Clock Buffers)
208-Pin
PQFP
100-Pin
TQFP
144-Pin
TQFP
176-Pin
TQFP
329-Pin
PBGA
144-Pin
FBGA
256-Pin
FBGA
484-Pin
FBGA
Device
A54SX08A
A54SX16A
A54SX32A
A54SX72A
130
175
174
171
81
81
81
–
113
113
113
–
–
–
–
–
111
111
111
–
–
–
180
203
203
–
147
–
249
–
249
360
Notes: Package Definitions: PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, PBGA = Plastic Ball Grid Array,
FBGA = Fine Pitch Ball Grid Array
ii
v5.3
ACTEL [ Actel Corporation ]
