SX Family FPGAs
Ordering Information
PQ
P
2
G
208
A54SX16
–
Application (Temperature Range)
Blank = Commercial (0 to +70˚C)
I = Industrial (–40 to +85˚C)
M = Military (–55 to +125˚C)
PP = Pre-production
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Package Type
BG = Ball Grid Array
PL = Plastic Leaded Chip Carrier
PQ = Plastic Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
VQ = Very Thin (1.0 mm) Quad Flat Pack
FG = Fine Pitch Ball Grid Array (1.0 mm)
Speed Grade
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
Blank = Not PCI Compliant
P = PCI Compliant
Part Number
A54SX08 = 12,000 System Gates
A54SX16 = 24,000 System Gates
A54SX16P = 24,000 System Gates
A54SX32 = 48,000 System Gates
Plastic Device Resources
User I/Os (including clock buffers)
PLCC
VQFP
PQFP
TQFP
TQFP
PBGA
PBGA
FBGA
Device
A54SX08
84-Pin
100-Pin
208-Pin
144-Pin
176-Pin
313-Pin
329-Pin
144-Pin
69
–
81
81
81
–
130
175
175
174
113
–
128
147
147
147
–
–
–
–
111
–
A54SX16
A54SX16P
A54SX32
–
113
113
–
–
–
–
249
249
–
Note: Package Definitions (Consult your local Actel sales representative for product availability):
PLCC = Plastic Leaded Chip Carrier
PQFP = Plastic Quad Flat Pack
TQFP = Thin Quad Flat Pack
VQFP = Very Thin Quad Flat Pack
PBGA = Plastic Ball Grid Array
FBGA = Fine Pitch (1.0 mm) Ball Grid Array
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v3.2
ACTEL [ Actel Corporation ]
