ProASIC
PLUS
Flash Family FPGAs
Device Resources
User I/Os
2
Commercial/Industrial
Military/MIL-STD-883B
CCGA/
LGA
CQFP
CQFP
TQFP
3
TQFP
3
PQFP
3
PBGA
3
FBGA
3
FBGA
3
FBGA
3
FBGA
3
FBGA
3
FBGA
3
100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin
Device
APA075
APA150
APA300
APA450
APA600
APA750
APA1000
66
66
107
158
158
158
5
158
158
5
158
158
5
242
290
5
344
356
5
356
356
5
100
100
100
5
100
186
4
186
4, 5
186
4
186
4, 5
344
4
370
4
454
454
562
6
642
5, 6
712
6
158
248
440
158
248
440
158
248
Notes:
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array
2. Each pair of PECL I/Os is counted as one user I/O.
3. Available in RoHS compatible packages. Ordering code is "G."
4. FG256 and FG484 are footprint-compatible packages.
5. Military Temperature Plastic Package Offering
6. FG896 and FG1152 are footprint-compatible packages.
General Guideline
Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee
performance beyond the limits specified within the datasheet.
v5.9
iii
ACTEL [ Actel Corporation ]
