P r o du c t B r i e f
MicroTCA
Power Module Reference Design
Features
•
Complete MicroTCA Power Module Reference
Design
– System Management by Actel Fusion™ Mixed-
Signal FPGA
– Compliant
to
MicroTCA.0
Specification
Revision 1.0
– Ready to Plug In for Evaluation and Inter-
operability Testing
– Single-Card Design with Half-Brick DC/DC
Converter Demonstrates the Incredible Space
Saving of the Fusion-Based Power Module
– Includes Hardware Design, HDL, and Software
– Includes a Power Module EMMC Interface (IP
and software)
– Reduced Part Count with More Features and
Performance Than MCU-Based Systems
– Reference Design Greatly Reduces Time to
Market and Development Effort
– Includes
Support
for
Power
Module
Redundancy and In-System Test and Firmware/
Software Upgrades via JTAG/JSM Interface
•
Less Than 50% of the Cost, Size, and Components
of Existing Power Modules Due to Superior
Analog and Digital Circuitry of Fusion Devices
Supports a Mix of Hardwired and MCU-Based
Functionality for Speedy Processing
Exceeds MicroTCA Specification for Power
Monitoring
In-System Reprogrammability Allows Customization
and Field Updates
Digitally Monitored and Configurable Voltage,
Current, and Temperature Thresholds with
Hardwired Fail-Safe Circuitry
Hot-Swap Compatible
Hardware and Software Support by Signal Stream
Technologies,
Including
Custom
Boards,
Assemblies, and Software
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Figure 1 •
Actel Power Module
October 2006
© 2006 Actel Corporation
1
See the Actel website for the latest version of the datasheet.