AD558
ABSOLUTE MAXIMUM RATINGS*
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
DB1
3
2
1 20 19
V
OUT
SENSE
DB0 (LSB)
NC
V
OUT
V
CC
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
V
OUT
. . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Momentary Short to V
CC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25°C to +100°C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300°C
Thermal Resistance
Junction to Ambient/Junction to Case
D (Ceramic) Package . . . . . . . . . . . . . . 100°C/W/30°C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140°C/W/55°C/W
(LSB) DB0
1
16 V
OUT
15 V
OUT
SENSE
14 V
OUT
SELECT
DB1 2
DB2 3
DB3 4
DB4 5
DB5 6
DB6
7
AD558
13 GND
TOP VIEW
12 GND
(Not to Scale)
11 +V
CC
10 CS
9
CE
(MSB) DB7 8
Figure 1a. AD558 Pin Configuration (DIP)
DB2 4
DB3 5
NC 6
DB4
DB5
7
8
18 V
OUT
SELECT
AD558
TOP VIEW
(Not to Scale)
17 GND
16 NC
15 GND
14 +V
CC
AD558 METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
9 10 11 12 13
(MSB) DB7
DB6
NC
CE
CS
NC = NO CONNECT
Figure 1a. AD558 Pin Configuration (DIP)
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
ORDERING GUIDE
Model
1
Temperature
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
–55°C to +125°C
–55°C to +125°C
Relative Accuracy
Error Max
T
MIN
to T
MAX
±
1/2 LSB
±
1/2 LSB
±
1/2 LSB
±
1/4 LSB
±
1/4 LSB
±
1/4 LSB
±
3/4 LSB
±
3/8 LSB
Full-Scale
Error, Max
T
MIN
to T
MAX
±
2.5 LSB
±
2.5 LSB
±
2.5 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
2.5 LSB
±
1 LSB
Package
Option
2
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
TO-116 (D-16)
TO-116 (D-16)
AD558JN
AD558JP
AD558JD
AD558KN
AD558KP
AD558KD
AD558SD
AD558TD
NOTES
1
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
Military Products Databook or current AD558/883B data sheet.
2
D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.
REV. A
–3–
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