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SOM-C3530DK-B00E 参数 Datasheet PDF下载

SOM-C3530DK-B00E图片预览
型号: SOM-C3530DK-B00E
PDF下载: 下载PDF文件 查看货源
内容描述: TI OMAP35 COM与Windows®嵌入式CE 6.0 [TI OMAP35 COM with Windows® Embedded CE 6.0]
分类和应用:
文件页数/大小: 2 页 / 1153 K
品牌: ADVANTECH [ Advantech Co., Ltd. ]
 浏览型号SOM-C3530DK-B00E的Datasheet PDF文件第2页  
SOM-C3530
Evaluation Kit
Features
TI OMAP35 COM with
Windows
®
Embedded CE 6.0
ƒ
ARM Cortex A8 600 MHz kernel & Built-in 430 MHz TMS320C64x+™ DSP
Core
ƒ
Supports MPEG 1/2/4 H.264 decode/encode. Video supports D1 resolution
directly up to 720P*
ƒ
H/W 2D/3D Acceleration directly supports OpenGL ES 2.0
ƒ
Rich I/O as LCD out, TV-out, Audio, USB, LAN, multi-COM (5), SD (2),
GPIO (20), I
2
C (2), SPI (1), keypad 6 x 6 matrix
ƒ
Supports wide range of working temperatures: -40 ~ 85° C (optional)
ƒ
Supports Embedded Linux2.6, Win CE 6.0, Android (project-based)
* 3rd party codec required to support 720P.
Microsoft
®
Windows
Embedded
®
Specifications
CPU
DSP
2D/3D Accelerators
OS
DRAM
Image/AP Flash
RTC
Watchdog
Power Management
COM
USB Host
USB Client
LAN
SD/MMC
GPIO
Hotkey/Matrix Key Pad
I
2
C
SPI
Buzzer Control
Graphic Chip
LCD Resolution
Brightness/Backlight Control
T/S
Video Out
Audio
DC-input
Power Consumption
Board Size
Weight
Operation Temperature
Operating Humidity
TI OMAP 3530 600 MHz
Built-in 430 MHz TMS320C64x+™ DSP Core
Supports OpenGL ES 2.0
Win CE 6.0 English professional version as default
256 MB
2 GB
Via S-35390A on CPU module
Via MAX6369KA-T on CPU module
Standard/Idle/Suspend mode
5 TTL level COM, 2 x Full Function; 3 x 4 wires
2 x USB 2.0 host ports
1 x USB 2.0 client port
1 x 10/100 (MAC + PHY on CPU module)
2 x SDIO/MMC interface
20-pin 3.3V TTL level DIO
6 x 6 matrix keypad
2
1
Yes
CPU internal 24-bit LCD controller
Default: 800 x 480 7" WVGA LVDS interface. Optional: 320 x 240 ~ 1920 x 1080
Yes
4-wire resistive type interface by ADS7846 on CPU module
Optional
Audio Codec on Computer-on-Module for Line-in, Line-out & Mic-in
3.3V+-5% and 3.6V+-5%
Normal run 0.6 Watt
Full run 1.2 Watt
68 mm x 68 mm x 7.5 mm (Computer-on-Module) (PCB 1.6 mm)
100g
0 ~ 60° C (32 ~ 140° F) (-20 ~ 70° C ;-40 ~ 85° C by project base)
5% ~ 95% Relative Humidity, non condensing
Kernel
Interface (All interfaces
with Industrial TTL 3.3 V
level)
Display
Power
Mechanical & Environment
RISC Computing Solutions
All product specifications are subject to change without notice
Last updated : 18-Jun-2012