ORCA
Series 3C and 3T FPGAs
Data Sheet
June 1999
represent the contributions of all components of a
package, which include the bond wires, all internal
package routing, and the external leads.
Four inductances in nH are listed: L
SW
and L
SL,
the
self-inductance of the lead; and L
MW
and L
ML
, the
mutual inductance to the nearest neighbor lead. These
parameters are important in determining ground
bounce noise and inductive crosstalk noise. Three
capacitances in pF are listed: C
M
, the mutual capaci-
tance of the lead to the nearest neighbor lead; and C
1
and C
2
, the total capacitance of the lead to all other
leads (all other leads are assumed to be grounded).
These parameters are important in determining capaci-
tive crosstalk and the capacitive loading effect of the
lead. The lead resistance value, R
W
, is in MΩ
.
The parasitic values in Table 78 are for the circuit
model of bond wire and package lead parasitics. If the
mutual capacitance value is not used in the designer’s
model, then the value listed as mutual capacitance
should be added to each of the C
1
and C
2
capacitors.
Package Coplanarity
The coplanarity limits of the
ORCA
Series 3 packages
are as follows.
Table 77. Package Coplanarity
Package Type
EBGA
PBGA
SQFP/SQFP2
Coplanarity Limit
(mils)
8.0
8.0
4.0
3.15
Package Parasitics
The electrical performance of an IC package, such as
signal quality and noise sensitivity, is directly affected
by the package parasitics. Table 78 lists eight parasitics
associated with the
ORCA
packages. These parasitics
Table 78. Package Parasitics
Package Type
208-Pin SQFP
208-Pin SQFP2
240-Pin SQFP
240-Pin SQFP2
256-Pin PBGA
352-Pin PBGA
432-Pin EBGA
600-Pin EBGA
L
SW
4
4
4
4
5
5
4
4
L
MW
2
2
2
2
2
2
1.5
1.5
R
W
200
200
200
200
220
220
500
500
C
1
1
1
1
1
1
1.5
1
1
C
2
1
1
1
1
1
1.5
1
1
C
M
1
1
1
1
1
1.5
0.3
0.4
L
SL
7—10
6—9
8—12
7—11
5—8
7—12
3—5.5
3—6
L
ML
4—6
4—6
5—8
4—7
2—4
3—6
0.5—1
0.5—1
L
SW
PAD N
R
W
L
SL
BOARD PAD
C
1
L
MW
C
M
L
ML
C
2
PAD N + 1
L
SW
R
W
C
1
L
SL
C
2
5-3862(F).a
Figure 104. Package Parasitics
196
Lucent Technologies Inc.
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