HCPL-061A/061N/063A/063N Outline Drawing
8
7
6
XXX
YWW
5
5.842 ± 0.203
(0.236 ± 0.008)
3.937 ± 0.127
(0.155 ± 0.005)
TYPE NUMBER (LAST 3 DIGITS)
2
3
4
1.270 BSG
(0.050)
5.080 ± 0.005
(0.200 ± 0.005)
7°
45° X 0.432
(0.017)
DATE CODE
0.381 ± 0.076
(0.016 ± 0.003)
PIN 1
ONE
3.175 ± 0.127
(0.125 ± 0.005)
1.524
(0.060)
0.152 ± 0.051
(0.006 ± 0.002)
0.228 ± 0.025
(0.009 ± 0.001)
DIMENSIONS IN MILLIMETERS AND (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.305
MIN.
(0.012)
Figure 3. 8-Pin Small Outline Package Device Drawing.
Solder Reflow Temperature Profile (HCPL-06XX and Gull Wing Surface Mount
Option 300 Parts)
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Note: Use of Nonchlorine Activated Fluxes is Recommended.
Regulatory Information
The HCPL-261A and HCPL-261N
families have been approved by
the following organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92. (HCPL-261A/261N
Option 060 only)
1-169
OPTOCOUPLERS
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
