Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚C/–0.5˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
200
PEAK
TEMP.
230˚C
TEMPERATURE (˚C)
2.5˚C ± 0.5˚C/SEC.
160˚C
150˚C
140˚C
3˚C + 1˚C/–0.5˚C
30
SEC.
30
SEC.
SOLDERING
TIME
200˚C
100
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
150
200
250
Regulatory Information
The HCPL-3180 is pending
approval by the following
organizations:
DIN EN 60747-5-2
Pending approval under DIN
EN-60747-5-2 with V
IORM
= 630
V
PEAK
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 2500 V
RMS.
Pending
3750 V
RMS.
CSA
Approval under CSA
Component.
3