board and components to prevent
thermal shock and begin evapo-
rating solvents from the solder
paste. The reflow zone briefly
elevates the temperature suffi-
ciently to produce a reflow of the
solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to
components due to thermal
250
shock. The maximum tempera-
ture in the reflow zone (T
MAX
)
should not exceed 235°C.
These parameters are typical for
a surface mount assembly
process for the INA-54063. As a
general guideline, the circuit
board and components should be
exposed only to the minimum
temperatures and times necessary
to achieve a uniform reflow of
solder.
T
MAX
200
TEMPERATURE (°C)
Electrostatic Sensitivity
RFICs are electro-
static discharge
(ESD) sensitive
devices. Although the
INA-54063 is robust in design,
permanent damage may occur to
these devices if they are sub-
jected to high energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equip-
ment) can discharge without
detection and may result in
degradation in performance,
reliability, or failure. Electronic
devices may be subjected to ESD
damage in any of the following
areas:
• Storage and handling
• Inspection and testing
• Assembly
• In-circuit use
The INA-54063 is an ESD Class 1
device. Therefore, proper ESD
precautions are recommended
when handling, inspecting,
testing, assembling, and using
these devices to avoid damage.
150
Reflow
Zone
100
Preheat
Zone
50
0
0
60
120
180
240
300
TIME (seconds)
Cool Down
Zone
Figure 17. Surface Mount Assembly Profile.
6-170
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
