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AIC1747-285GU3 参数 Datasheet PDF下载

AIC1747-285GU3图片预览
型号: AIC1747-285GU3
PDF下载: 下载PDF文件 查看货源
内容描述: 300毫安线性稳压器,旁路引脚 [300mA Linear Regulator With Bypass Pin]
分类和应用: 稳压器
文件页数/大小: 22 页 / 620 K
品牌: AIC [ ANALOG INTERGRATIONS CORPORATION ]
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AIC1747  
APPLICATION INFORMATION  
conductivity is used, the junction temperature  
will be low even when large power dissipation  
applies.  
INPUT-OUTPUT CAPACITORS  
Linear regulators require input and output  
capacitors to maintain stability. Input capacitor at  
1µF with 1uF output capacitor is recommended.  
The power dissipation across the device is  
P = IOUT (VIN-VOUT).  
POWER DISSIPATION  
The maximum power dissipation is:  
The AIC1747 obtains thermal-limiting circuitry,  
which is designed to protect the device against  
overload condition. For continuous load  
(TJ-max - TA )  
PMAX =  
RθJA  
Where TJ-max is the maximum allowable junction  
temperature (150°C), and TA is the ambient  
temperature suitable in application.  
condition,  
maximum  
rating  
of  
junction  
temperature must not be exceeded. It is  
important to pay more attention in thermal  
resistance. It includes junction to case, junction  
to ambient. The maximum power dissipation of  
AIC1747 depends on the thermal resistance of  
its case and circuit board, the temperature  
difference between the die junction and ambient  
air, and the rate of airflow. The rate of  
temperature rise is greatly affected by the  
mounting pad configuration on the PCB, the  
board material, and the ambient temperature.  
When the IC mounting with good thermal  
As a general rule, the lower temperature is, the  
better reliability of the device is. So the PCB  
mounting pad should provide maximum thermal  
conductivity to maintain low device temperature.  
GND pin performs a dual function for providing  
an electrical connection to ground and  
channeling heat away. Therefore, connecting  
the GND pin to ground with a large pad or  
ground plane would increase the power  
dissipation and reduce the device temperature.  
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