AT1605
High-Side Power Switch IC
Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
-Temperature Min(Tsmin)
-Temperature Max (Tsmax)
-Time (min to max)(ts)
Tsmax to TL
-Ramp-up Rate
Time maintained above:
-Temperature (TL)
-Time (tL)
Peak Temperature(TP)
Time within 5°C of actual Peak
Temperature (tP)
Ramp-down Rate
Time
25°C
to
Peak
Temperature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Pkg. thickness
Pkg. thickness
<2.5mm or Pkg.
≥2.5mm
or Pkg.
3
3
volume
≥350mm
volume <350mm
3°C/second max.
Pb-Free Assembly
Large Body
Small Body
Pkg. thickness
Pkg. thickness
≥2.5mm
or Pkg.
≥2.5mm
or Pkg.
3
volume
≥350mm
volume
≥350mm
3
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
3°C/second max.
183°C
60-150 seconds
225+0/-5°C
10-30 seconds
240+0/-5°C
10-30 seconds
217°C
60-150 seconds
245+0/-5°C
10-30 seconds
250+0/-5°C
20-40 seconds
6°C/second max.
6 minutes max.
3°C/second max.
8 minutes max.
*
All temperatures refer to topside of the package, measured on the package body surface.
7F, No.9, PARK AVENUE II, Science-Based Industrial Park, Hsinchu 300, Taiwan, R.O.C.
Tel: 886-3-563-0878
Fax: 886-3-563-0879
WWW:
http://www.aimtron.com.tw
4/26/2006 REV:1.1
Email:
service@aimtron.com.tw
10
AIMTRON [ AIMTRON TECHNOLOGY ]
