A1201, A1202,
A1203, and A1204
Continuous-Time Bipolar Switch Family
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions
Package LH, 1-layer PCB with copper limited to solder pads
Package Thermal Resistance
R
θJA
Package LH, 2-layer PCB with 0.463 in.
2
of copper area each
side connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads
Value Units
228
110
165
ºC/W
ºC/W
ºC/W
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
20
Power Derating Curve
T
J(max)
= 165ºC; I
CC
= I
CC(max)
V
CC(max)
Maximum Allowable V
CC
(V)
Package LH, 2-layer PCB
(R
JA
= 110 ºC/W)
Package UA, 1-layer PCB
(R
JA
= 165 ºC/W)
Package LH, 1-layer PCB
(R
JA
= 228 ºC/W)
V
CC(min)
40
60
80
100
120
140
160
180
Power Dissipation versus Ambient Temperature
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
20
Power Dissipation, P
D
(mW)
Pa
(R cka
ge
JA
= 1 LH
10 , 2-
Pac
ºC lay
/W er
(R kage
PC
)
UA
JA
=
B
, 1-
165
ºC/ la yer
W)
PC
B
Pac
k
(R age LH
,1
JA
= 2
28 º -layer
PCB
C/W
)
40
60
80
100
120
Temperature (°C)
140
160
180
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
4
ALLEGRO [ ALLEGRO MICROSYSTEMS ]
