A3904
Low Voltage Voice Coil Motor Driver
CW Package, 8-Bondpad Bare Die
0.330
Die Alignment on Wafer
Die Pitch 1.100
×
0.750
1.055
8X0.065 B
B 8X0.065
0.705
A
Top layer polymide
All dimensions nominal; not for tooling use
Dimensions in millimeters
Exact configuration at supplier discretion within limits shown
A Die orientation mark area
B Bond pad opening in passivation
IOUT
SLEEPZ
SCL
SDA
SCL
GND
IOUT
VDD
Bondpad*
GND
IOUT_1
IOUT_2
SDA
SCL_1
SCL_2
SLEEPZ
VDD
X Coordinate
(μm)
444.5
408.7
319.95
–421.65
136.3
–421.65
–421.65
396.15
Y Coordinate
(μm)
269.45
9.7
233.55
–242.6
–243.7
9.0
242.6
–238.5
*Redundant bondpads are electrically equivalent and provide alternative
locations for bonding.
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8
ALLEGRO [ ALLEGRO MICROSYSTEMS ]
