GaAs Flip Chip Schottky Diodes
Suggested Setup Values For WEST-BOND
Model 7200A Epoxy Die Bonder
Materials
Epoxy
Microelectronic grade one component, solvent-free
silver-filled, electrically conductive adhesive — example:
Ablebond 8380 by Ablestick.
Dispense Tube
WEST-BOND B-1831-1 with 9.5 mil I.D., or WEST-BOND
B-1831-2 with 15.5 mil I.D. Other sizes available.
Die Pickup Tool
SPT Part Number 2101-W625-CT-031 x 0.016 x 0.0075.
Hole diameter 0.016" face diameter 0.031", O.D. 0.625".
Use vacuum pressure to pick and place chip.
Adjustment
Bond Force
35 grams at tool.
Dispense Air
30 psi.
Dispense Time
To give diameter of dot required.
Curing Time
Temperature
250°C
130°C
100°C
85°C
Time
10 min.
20 min.
60 min.
120 min.
Flexible Conductive Epoxy Mounting of
Alpha Beamless Flip Chip Diodes – To
Soft or Hard Substrate – As Plated
10 Mil Gap
Conductive Epoxy
Drops (Minimum Amount)
Approximately 8 mil Diameter
1–2 mil height
Deposit Conductive Epoxy
Perform Die Attach
• Flip Device
• Align Bond Pads to Epoxy Dot
(Alignment Marks Help)
• Use Even Pressure to Make Correct Connection
Acceptable
Epoxy Runout
Excessive
Epoxy Runout
Cure Epoxy & DC Continuity Check
• Inspect for Adequate Epoxy Fillet
• Cure According to Mfg. Preferred Schedule.
Typically 110–150°C @ 60 Minutes, or 150°C,
4 Minutes for Snap-Cure Epoxies
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 3/00A
3
ALPHA [ ALPHA INDUSTRIES ]
