Switch Type Multi Control Devices
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method:
Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）at solder joints copper foil surface）. A heat resistive tape
should be used to fix thermocouple.
3. Temperature profile
Multi Control
Devices
300
A max.
B
200
D
E
100
Room
temperature
Time (s)
Pre-heating
F max.
C
A（℃）
3s max.
Serie（s Reflow type）
B（℃）
C（s）
D（℃）
E（℃）
（F s）
RKJXS
SLLB, SLLB5
260
40
20
40
150
180
240
260
230
150
120
Variable
Resistor Type
SKRV/SKRH/SKQUBA,DB/SSAF/SRBE
Switch
Type
Notes
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
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ALPS [ ALPS ELECTRIC CO.,LTD. ]
