Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.
3. Temperature profile（Surface of products）.
For
SD Memory
Card
For
microSD™
Card
240℃(max.)
230℃(min.)
For
200
100
SIM Card
8pins
180℃
150℃
For
W-SIM
For
Memory
Stick Micro™
Room
temperature
Time (s)
For
Memory
Stick™
Pre-heating
90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For
Compact
Flash™
For PC cards
supporting
CardBus
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
For
Express
Card™
For CMOS
Camera Module
5. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.
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ALPS [ ALPS ELECTRIC CO.,LTD. ]
