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SKEGADA010 参数 Datasheet PDF下载

SKEGADA010图片预览
型号: SKEGADA010
PDF下载: 下载PDF文件 查看货源
内容描述: 6毫米广场(按入) [6mm Square(Snap-in Type)]
分类和应用:
文件页数/大小: 5 页 / 231 K
品牌: ALPS [ ALPS ELECTRIC CO.,LTD. ]
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TM  
TACT Switch  
Soldering Conditions  
Condition for Reflow  
Available for Surface Mount Type.  
1. Heating method: Double heating method with infrared heater.  
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CAKor CCTat solder joints copper foil surface. A heat resistive tape  
Detector  
Push  
should be used to fix thermocouple.  
3. Temperature profile  
Temperature (˚C )  
Slide  
260˚C max. 3 sec max.  
Rotary  
Encoders  
Power  
230˚C  
180  
150  
Time  
Dual-in-line  
Package Type  
120 secm ax.pre-heating )  
40s max.  
TACT SwitchTM  
3 to 4min.  
Custom-  
Products  
Time inside soldering equipment  
Note  
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC  
board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards  
and others. The above-stated conditions shall also apply to switch surface temperatures.  
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is  
highly recommended.  
Sharp  
Feeling  
Conditions for Auto-dip  
Manual Soldering Except SKRT Series)  
Soft  
Feeling  
Available for Snap-in Type and Radial Type  
Items  
Condition  
Except SKHJ, SKHL, SKQJ, SKQK, SKEG series)  
Snap-in  
Type  
Soldering temperature  
Duration of soldering  
350max.  
3s max.  
Items  
Flux built-up  
Condition  
Surface  
Mount Type  
Mounting surface  
should not be exposed to fluk  
Capacity of soldering iron  
60W max.  
Radial  
Type  
Ambient temperature of the soldered  
surface of PC board.  
Preheating temperature  
100max.  
Preheating time  
60s max.  
Soldering temperature  
Duration of immersion  
Number of soldering  
260max.  
5s max.  
2times max.  
Notes  
1. Consult with us for availability of TACT SwitchTM washing.  
2. Prevent flux penetration from the top side of the TACT SwitchTM.  
3. Switch terminals and a PC board should not be coated with flux prior to soldering.  
4. The second soldering should be done after the switch is stable with normal temperature.  
5. Use the flux with a specific gravity of min 0.81.  
EC-19S-8 by TAMURA Corporation, or equivalents.)  
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