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SKHLLDA010 参数 Datasheet PDF下载

SKHLLDA010图片预览
型号: SKHLLDA010
PDF下载: 下载PDF文件 查看货源
内容描述: 6 × 3.5毫米紧凑型(按入) [6×3.5mm Compact (Snap-in Type)]
分类和应用:
文件页数/大小: 4 页 / 202 K
品牌: ALPS [ ALPS ELECTRIC CO.,LTD. ]
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TACT Switch
TM
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
(K)
CC
or
(T)
solder joints copper foil surface) A heat resistive tape
at
.
Detector
Push
Slide
Rotary
Encoders
Power
should be used to fix thermocouple.
3. Temperature profile
Temperature (˚C )
260˚C max. 3 sec max.
180
150
Time
230˚C
Dual-in-line
Package Type
TACT Switch
TM
120 sec max. pre-heating )
3 to 4min.
40s max.
Custom-
Products
Time inside soldering equipment
Note
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Sharp
Feeling
Soft
Feeling
Snap-in
Type
Surface
Mount Type
Radial
Type
Conditions for Auto-dip
Available for Snap-in Type and Radial Type
(Except
SKHJ, SKHL, SKQJ, SKQK, SKEG series)
Items
Flux built-up
Condition
Mounting surface
should not be exposed to fluk
Ambient temperature of the soldered
surface of PC board.
100℃ max.
60s max.
260℃ max.
5s max.
2times max.
Manual Soldering(Except SKRT Series)
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
350℃max.
3s max.
60W max.
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
Number of soldering
Notes
1.
2.
3.
4.
5.
Consult with us for availability of TACT Switch
TM
washing.
Prevent flux penetration from the top side of the TACT Switch
TM
.
Switch terminals and a PC board should not be coated with flux prior to soldering.
The second soldering should be done after the switch is stable with normal temperature.
Use the flux with a specific gravity of min 0.81.
(EC-19S-8
by TAMURA Corporation, or equivalents.)
306