Switch Type Multi Control Devices
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method:
Multi Control
Devices
Double heating method with infrared heater.
should be used to fix thermocouple.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
（K）
CC
or
（T）
solder joints copper foil surface） A heat resistive tape
at
.
3. Temperature profile
300
Temperature (˚C )
A max.
B
200
D
E
100
Time (s)
Pre-heating
F max.
C
Room
temperature
Series Reflow type）
（
RKJXS
SLLB, SLLB5
Variable
Resistor Type
Switch
Type
SKRV/SKRH/SKQUBA,DB/SSAF/SRBE
A
（℃）
3s max.
260
240
260
B
（℃）
C
（s）
40
D
（℃）
150
E
（℃）
（
F s）
230
20
40
180
150
120
Notes
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
492
ALPS [ ALPS ELECTRIC CO.,LTD. ]
