Push Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape
Detector
Push
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT Switch
TM
Custom-
Products
Series Reflow type）
（
SPEE
260
230
40
180
150
120
should be used for fixed measurement.
3. Temperature profile
300
Temperature (˚C )
A max.
B
200
D
E
100
Time (s)
Pre-heating
F max.
C
Room
temperature
A
（℃）
3s max.
B
（℃）
C
（s）
D
（℃）
E
（℃）
F
（s）
SPEF, SPEG
Notes
Horizontal
Type
Vertical
Type
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
108
ALPS [ ALPS ELECTRIC CO.,LTD. ]
