Detector Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
（K）
CC
or
（T）
soldering portion
at
（copper
foil surface） A heat resisting tape
.
should be used for fixed measurement.
3. Temperature profile
Detector
Push
300
Temperature (˚C )
A max.
B
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT Switch
TM
200
D
E
100
Time (s)
Pre-heating
F max.
C
Room
temperature
Custom-
Products
Series Reflow type）
（
SPPB
A
（℃）
3s max.
B
（℃）
230
C
（s）
40
20
D
（℃）
E
（℃）
F
（s）
250
SPPW8
SPVE
SPVG
SPVL
SPVM
SPVN
SPVP
SPVR
SPVS
SSCM
SPPY5
240
260
200
180
40
230
150
120
20
150
Room
temperature
180
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
79
ALPS [ ALPS ELECTRIC CO.,LTD. ]
