Dual In-line Package Type Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
（K）
CC
or
（T）
soldering portion copper foil surface）A heat resisting tape should
at
（
.
Detector
Push
Slide
be used for fixed measurement.
3. Temperature profile
300
Temperature (˚C )
A max.
B
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT Switch
TM
200
C
100
Time (s)
Pre-heating
D max.
E max.
F
20 max.
Room
temperature
Custom-
Products
Series Reflow type）
（
SSGM
A
（℃）
3s max.
240
B
（℃）
230
C
（℃）
150
D
（s）
120
E s）
（
（
F s）
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
244
ALPS [ ALPS ELECTRIC CO.,LTD. ]
