Slide Switches
Soldering Conditions
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA
（K）
CC
or
（T）
soldering portion
at
（copper
foil surface） A heat resisting tape
.
should be used for fixed measurement.
Detector
Push
3. Temperature profile
300
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
TACT Switch
TM
Custom-
Products
Temperature (˚C )
A max.
B
200
C
100
Time (s)
Pre-heating
D max.
E max.
F
※
20 max.
Room
temperature
Series Reflow type）
（
Small size
General Use type
Big size
General Use type
Other Use type
SSSS2
Vertical
Horizontal
Vertical
1-pole, 3-positions
A
（℃）
3s max.
250
B
（℃）
C
（℃）
D
（s）
E
（s）
F
（s）
1-pole, 2-positions
1-pole, 2-positions
200
Horizontal
1-pole, 3-positions
2-poles, 3-positions
240
SSSS7
SSAH, SSAG
SSAD
1-pole, 2-positions
1-pole, 3-positions 1.5mm）
（
Horizontal
SSSS8
1-pole, 3-positions 2mm）
（
1-pole, 4-positions
2-poles, 2-positions
Vertical
250
260
240
230
220
150
120
255
200
240
220
Notes
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
3.
※SSAH
and SSAG only 40's.
154
ALPS [ ALPS ELECTRIC CO.,LTD. ]
