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AS7C1025B-10JC 参数 Datasheet PDF下载

AS7C1025B-10JC图片预览
型号: AS7C1025B-10JC
PDF下载: 下载PDF文件 查看货源
内容描述: 5V 128K X 8 CMOS SRAM (中心电源和地) [5V 128K X 8 CMOS SRAM (Center power and ground)]
分类和应用: 静态存储器
文件页数/大小: 9 页 / 104 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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AS7C1025B  
®
Functional description  
The AS7C1025B is a high-performance CMOS 1,048,576-bit Static Random Access Memory (SRAM) devices organized as 131,072 x 8  
bits. They are designed for memory applications where fast data access, low power, and simple interfacing are desired.  
Equal address access and cycle times (tAA, tRC, tWC) of 10/12/15/20 ns with output enable access times (tOE) of 5/6/7/8 ns are ideal for high-  
performance applications. The chip enable input CE permits easy memory and expansion with multiple-bank memory systems.  
When CE is high, the device enters standby mode. If inputs are still toggling, the device will consume ISB power. If the bus is static, then full  
standby power is reached (ISB1). For example, the AS7C1026B is guaranteed not to exceed 55 mW under nominal full standby conditions.  
A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input pins I/O0 through I/O7 is written on  
the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external devices should drive I/O pins only after  
outputs have been disabled with output enable (OE) or write enable (WE).  
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chips drive I/O pins  
with the data word referenced by the input address. When either chip enable or output enable is inactive or write enable is active, output  
drivers stay in high-impedance mode.  
All chip inputs and outputs are TTL-compatible, and operation is from a single 5 V supply. The AS7C1025B is packaged in common  
industry standard packages.  
Absolute maximum ratings  
Parameter  
Symbol  
Min  
–0.50  
–0.50  
Max  
Unit  
V
Voltage on V relative to GND  
V
V
+7.0  
CC  
t1  
t2  
D
Voltage on any pin relative to GND  
Power dissipation  
V
+ 0.5  
V
CC  
P
1.0  
+150  
+125  
20  
W
o
Storage temperature (plastic)  
T
–65  
–55  
C
stg  
bias  
o
Ambient temperature with V applied  
T
C
CC  
DC current into outputs (low)  
I
mA  
OUT  
NOTE: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and func-  
tional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure  
to absolute maximum rating conditions for extended periods may affect reliability.  
Truth table  
CE  
H
L
WE  
X
OE  
X
Data  
Mode  
Standby (I , I  
High Z  
High Z  
)
SB SB1  
H
H
Output disable (I  
)
CC  
L
H
L
D
Read (I  
)
CC  
OUT  
L
L
X
D
Write (I  
)
IN  
CC  
Key: X = don’t care, L = low, H = high.  
3/26/04, v. 1.3  
Alliance Semiconductor  
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