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AS7C34098A-10TI 参数 Datasheet PDF下载

AS7C34098A-10TI图片预览
型号: AS7C34098A-10TI
PDF下载: 下载PDF文件 查看货源
内容描述: 3.3 V 256的K× 16的CMOS SRAM [3.3 V 256 K x 16 CMOS SRAM]
分类和应用: 存储静态存储器
文件页数/大小: 10 页 / 152 K
品牌: ALSC [ ALLIANCE SEMICONDUCTOR CORPORATION ]
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AS7C34098A  
®
Functional description  
The AS7C34098A is a high-performance CMOS 4,194,304-bit Static Random Access Memory (SRAM) device organized as  
262,144 words × 16 bits. It is designed for memory applications where fast data access, low power, and simple interfacing are  
desired.  
Equal address access and cycle times (t , t , t ) of 10/12/15/20 ns with output enable access times (t ) of 4/5/6/7 ns are  
AA RC WC  
OE  
ideal for high-performance applications. The chip enable input CE permits easy memory expansion with multiple-bank  
memory systems.  
When CE is high the device enters standby mode. The device is guaranteed not to exceed 28.8mW power consumption in  
CMOS standby mode. A write cycle is accomplished by asserting write enable (WE) and chip enable (CE). Data on the input  
pins I/O1–I/O16 is written on the rising edge of WE (write cycle 1) or CE (write cycle 2). To avoid bus contention, external  
devices should drive I/O pins only after outputs have been disabled with output enable (OE) or write enable (WE).  
A read cycle is accomplished by asserting output enable (OE) and chip enable (CE), with write enable (WE) high. The chip  
drives I/O pins with the data word referenced by the input address. When either chip enable or output enable is inactive, or  
write enable is active, output drivers stay in high-impedance mode.  
The device provides multiple center power and ground pins, and separate byte enable controls, allowing individual bytes to be  
written and read. LB controls the lower bits, I/O1–I/O8, and UB controls the higher bits, I/O9–I/O16.  
All chip inputs and outputs are TTL- and CMOS-compatible, and operation is for 3.3V (AS7C34098A) supply. The device is  
available in the JEDEC standard 400-mL, 44-pin SOJ, TSOP 2.  
Absolute maximum ratings  
Parameter  
Voltage on VCC relative to GND  
Voltage on any pin relative to GND  
Power dissipation  
Symbol  
Vt1  
Min  
–0.50  
–0.50  
Max  
+5.0  
Unit  
V
Vt2  
VCC +0.50  
1.5  
V
PD  
W
Storage temperature (plastic)  
Ambient temperature with VCC applied  
DC current into outputs (low)  
Tstg  
–65  
–55  
+150  
°C  
°C  
mA  
Tbias  
IOUT  
+125  
±20  
Note: Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and  
functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for extended periods may affect reliability.  
Truth table  
CE  
H
WE  
X
OE  
X
LB  
X
X
H
L
UB  
X
X
H
H
L
I/O1–I/O8  
High Z  
I/O9–I/O16  
High Z  
Mode  
Standby (I , I  
)
SB SB1  
L
H
H
High Z  
High Z  
High Z  
Output disable (I  
)
CC  
L
X
X
D
OUT  
L
L
H
L
L
H
L
High Z  
D
D
Read (I  
)
CC  
OUT  
OUT  
L
D
OUT  
L
H
L
D
High Z  
IN  
X
H
L
High Z  
D
D
IN  
IN  
L
D
Write (I  
)
IN  
CC  
Key: X = Don’t care, L = Low, H = High.  
8/17/04,v. 2.1  
Alliance Semiconductor  
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