Features
Cyclone devices are available in quad flat pack (QFP) and space-saving
FineLine® BGA packages (see Table 1–2 through 1–3).
Table 1–2. Cyclone Package Options & I/O Pin Counts
100-Pin TQFP 144-Pin TQFP 240-PinPQFP
256-Pin
324-Pin
400-Pin
Device
(1)
(1), (2)
(1)
FineLine BGA FineLine BGA FineLine BGA
EP1C3
65
104
EP1C4
EP1C6
EP1C12
EP1C20
249
301
301
98
185
173
185
185
249
233
Notes to Table 1–2:
(1) TQFP: thin quad flat pack.
PQFP: plastic quad flat pack.
(2) Cyclone devices support vertical migration within the same package (i.e., designers can migrate between the
EP1C3 device in the 144-pin TQFP package and the EP1C6 device in the same package)
Vertical migration means you can migrate a design from one device to
another that has the same dedicated pins, JTAG pins, and power pins, and
are subsets or supersets for a given package across device densities. The
largest density in any package has the highest number of power pins; you
must use the layout for the largest planned density in a package to
provide the necessary power pins for migration.
For I/O pin migration across densities, cross-reference the available I/O
pins using the device pin-outs for all planned densities of a given package
type to identify which I/O pins can be migrated. The Quartus® II
software can automatically cross-reference and place all pins for you
when given a device migration list. If one device has power or ground
pins, but these same pins are user I/O on a different device that is in the
migration path,the Quartus II software ensures the pins are not used as
user I/O in the Quartus II software. Ensure that these pins are connected
to the appropriate plane on the board. The Quartus II software reserves
I/O pins as power pins as necessary for layout with the larger densities
in the same package having more power pins.
Altera Corporation
January 2007
1–3
Preliminary
ALTERA [ ALTERA CORPORATION ]
