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PPC440GX-3RF533CZ 参数 Datasheet PDF下载

PPC440GX-3RF533CZ图片预览
型号: PPC440GX-3RF533CZ
PDF下载: 下载PDF文件 查看货源
内容描述: 的Power PC 440GX嵌入式处理器 [Power PC 440GX Embedded Processor]
分类和应用: 微控制器和处理器外围集成电路微处理器PC时钟
文件页数/大小: 93 页 / 1501 K
品牌: AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
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Part Number 440GX
Revision 1.15 – August 30, 2007
440GX
Power PC 440GX Embedded Processor
Features
• PowerPC
®
440 processor core operating up to
800MHz with 32KB I- and D-caches (with parity
checking)
• On-chip 256KB SRAM configurable as L2 Code
store or Ethernet Packet store memory
• Selectable processor:bus clock ratios (Refer to
the Clocking chapter in the
PPC440GX
Embedded Processor User’s Manual
for details)
• Double Data Rate (DDR) Synchronous DRAM
(SDRAM) interface operating up to 166MHz
(200MHz for 800MHz Rev F parts)
• External Peripheral Bus (32 bits) for up to eight
devices with external mastering
• DMA support for external peripherals, internal
UART and memory
• PCI-X V1.0a interface (32 or 64 bits, up to
133MHz) with support for conventional PCI V2.3
• Two Ethernet 10/100/1000Mbps half- or full-
duplex interfaces. Operational modes supported
are SMII, GMII, RGMII, TBI and RTBI.
Data Sheet
• TCP/IP Acceleration Hardware (TAH) provided for
10/100/1000 Mbps ports that performs checksum
processing, TCP segmentation, and includes
support for jumbo frames
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• I2O Messaging unit for message transfer between
the CPU and PCI-X
• Programmable General Purpose Timers (GPT)
• Two serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Processor can boot from PCI memory
• Available in ceramic (RoHs and non-RoHS
compliant versions) and plastic packages (RoHS
and non-RoHS compliant versions).
Description
Designed specifically to address high-end embedded
applications, the PowerPC 440GX (PPC440GX)
provides a high-performance, low power solution that
interfaces to a wide range of peripherals by
incorporating on-chip power management features
and lower power dissipation.
This chip contains a high-performance RISC
processor core, DDR SDRAM controller, configurable
256KB SRAM to be used as L2 cache or software-
controlled on-chip memory, PCI-X bus interface,
Gigabit Ethernet interfaces, TCP/IP acceleration
hardware, I2O messaging unit, control for external
ROM and peripherals, DMA with scatter-gather
support, serial ports, IIC interface, and general
purpose I/O.
Technology: CMOS Cu-11, 0.13μm
Packages: 25mm, 552-ball Ceramic Ball Grid Array
(CBGA) or Plastic Ball Grid Array (PBGA) in standard
or RoHS compliant versions
Power (estimated): Less than:
4W typical @533MHz
5W typical @667MHz
6W typical @800MHz (estimated)
Supply voltages required: 3.3V, 2.5V, 1.5V
AMCC
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