Part Number 440SPe
Revision 1.23 - Sept 21, 2006
Preliminary Data Sheet
PowerPC 440SPe Embedded Processor
Features
• PowerPC
®
440 processor core operating up to
667 MHz with 32KB I- and D-caches (with parity
checking)
• On-chip 256KB SRAM configurable as L2 Cache
or Ethernet Packet/Code store memory
• Selectable Processor vs Bus clock ratios (Refer to
the Clocking chapter in the
PPC440SPe
Embedded Processor User’s Manual
for details)
• Support up to 16 GB (4 Chip Selects) of 64-bit/32-
bit SDRAM with ECC
DDR I 266-333-400
DDR II 400-533-667
• Three PCI-Express serial interfaces:
one 8 lanes and two 4 lanes - 2.5Gb/s per lane
Root and Endpoint support.
Opaque bridge
• One 64-bit DDR PCI-X interfaces up to 133 MHz
(DDR 266) with support for conventional PCI
• Optional: High throughput RAID 6 hardware
acceleration, performs XOR and Galois Field P &
Q parity computations, supports up to 255 drives
• Optional:16 Programmable Galois Field
polynomials including 14d and 11d
• XOR Accelerator with DMA controller
• I2O messaging with two DMA controllers
• External Peripheral Bus (16-bit Data, 27-bit
Address) for up to three devices; Bank0=16 MB,
Bank1 and Bank2=128 MB each
• One Ethernet 10/100/1000Mbps half- or full-
duplex interface. Operational modes supported
are MII and GMII.
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• Programmable General Purpose Timers (GPT)
• Three serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Processor can boot from PCI memory
Description
Designed specifically to address high-end embedded
applications for storage, the PowerPC 440SPe
(PPC440SPe) provides a high-performance, low
power solution that interfaces to a wide range of
peripherals by incorporating on-chip power
management features and lower power dissipation.
This chip contains a high-performance RISC
processor core, a DDR1/DDR2 SDRAM controller,
configurable 256KB SRAM to be used as L2 cache or
software-controlled on-chip memory, three PCI-
Express interfaces, one DDR PCI-X bus interface, a
1Gbps Ethernet interface, an I2O/DMA controller,
control for external ROM and peripherals, optional
RAID 6 acceleration, an XOR DMA unit, serial ports,
IIC interfaces, and general purpose I/O.
Technology: CMOS Cu-11, 0.13mm
Package: 27mm, 675-ball, 1mm pitch, Flip Chip-
Plastic Ball Grid Array (FC-PBGA)
Power (estimated): Less than 14W @533MHz
Supply voltages required: 3.3V, 2.5V, 1.8V, 1.5V
AMCC Proprietary
1
AMCC [ APPLIED MICRO CIRCUITS CORPORATION ]
