Special Handling Instructions for FBGA
Packages
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150
°
C for prolonged periods of time.
PIN CONFIGURATION
A0–A20=21 addresses
DQ0–DQ7=8 data inputs/outputs
CE# = Chip enable
OE# = Output enable
WE# = Write enable
RESET#=Hardware reset pin, active low
RY/BY#=Ready/Busy output
V
CC
= 3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
V
SS
NC
= Device ground
= Pin not connected internally
LOGIC SYMBOL
21
A0–A20
DQ0–DQ7
8
CE#
OE#
WE#
RESET#
RY/BY#
Am29LV017D
11
AMD [ ADVANCED MICRO DEVICES ]
