CONNECTION DIAGRAMS
RESET#
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
DQ0
DQ8
DQ1
DQ9
DQ2
DQ10
DQ3
DQ11
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
WE#
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
V
SS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
CC
SO
FBGA
Top View, Balls Facing Down
A6
A13
A5
A9
A4
WE#
A3
RY/BY#
A2
A7
A1
A3
B6
A12
B5
A8
B4
RESET#
B3
NC
B2
A17
B1
A4
C6
A14
C5
A10
C4
NC
C3
A18
C2
A6
C1
A2
D6
A15
D5
A11
D4
A19
D3
NC
D2
A5
D1
A1
E6
A16
E5
DQ7
E4
DQ5
E3
DQ2
E2
DQ0
E1
A0
F6
G6
H6
V
SS
H5
DQ6
H4
DQ4
H3
DQ3
H2
DQ1
H1
V
SS
BYTE# DQ15/A-1
F5
DQ14
F4
DQ12
F3
DQ10
F2
DQ8
F1
CE#
G5
DQ13
G4
V
CC
G3
DQ11
G2
DQ9
G1
OE#
Special Handling Instructions
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
6
Am29LV160D
AMD [ ADVANCED MICRO DEVICES ]
